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更新日期 Updated date: 2018.11.17

2018 国际技术会议

2018 International Technical Conference

2018.12.5 星期三 Wednesday AM

市场动态分享 Market Track

时间 Time 议题 Topic

10:45 – 11:00

专题演讲 Keynote 1 钟泰强先生 – 香港线路板协会会长/ 迅达科技企业(香港)有限公司, 亚太区业务发展执行副总裁 Mr. Canice Chung, Chairman, HKPCA / Executive Vice President, Asia Pacific Business Development, TTM Technologies Enterprises (HK) Ltd. (英文演讲 English)

11:00 – 11:15

专题演讲 Keynote 2 Bob Neves 先生, IPC 董事会秘书&司库，IPC 执行委员会成员 Mr. Bob Neves, Secretary & Treasurer, IPC Board of Directors & Member of IPC Executive Committee (英文演讲 English)

11:15 – 11:40

线路板市场当前的状况和未来的发展趋势 (特别强调车用线路板) The Current and Future Status of PCB (with Special Emphasis on Automotive PCB) Hayao Nakahara 博士, N.T. Information Ltd. 总裁 Dr. Hayao Nakahara, President, N.T. Information Ltd. (英文演讲 English)

11:40 – 12:05

线路板行业发展的驱动力和前景 The Drivers and Outlook of the PCB Industry 姜旭高博士, Managing Partner, Prismark Dr. Shiuk-Kao Chiang, Managing Partner, Prismark

12:05 – 14:00 午休时间 Lunch Break



2018.12.5 星期三 Wednesday PM

市场动态分享 Market Track


14:00 – 14:30

对汽车和物联网产品上应用的 PCB 可靠性测试 PCB Reliability Test for Automotive and IoT Products Application 黄婉仪女士, 香港生产力促进局汽车及电子部, 高级工程经理 Ms. Angel Wong, Senior Engineering Manager, Automotive & Electronics Division, Hong Kong Productivity Council

14:30 – 15:00

PCBA 在汽车电子的应用 Build for Automotive 朱惠璋先生, 德丰电业有限公司董事长 Mr. Wilson Chu, Chairman of Defond Electrical Industries Ltd.

15:00 – 15:30

消费电子用线路板技术发展趋势 A View on Consumer PCB Technology Trends Erkko Helminen 先生–迅达科技企业(香港)有限公司, 企业先进发展高级经理 Mr. Erkko Helminen, Senior Manager Advanced Development – Corporate, TTM Technologies, Inc. (英文演讲 English)

15:30 – 16:00

2018 中国环保政策热点解读 A view of 2018 China's Environmental Protection Policy 王乐得先生, 香港线路板协会, 副会长兼秘书长 Mr. Luther Wong, Vice Chairman & Secretary General, HKPCA

*除了特别备注外, 所有演讲以中文進行。

*All presentations will be given in Chinese unless special remark.

执行机构支持机构拨款资助在此刊物上／活动内（或项目小组成员）表达的任何意见、研究成果、结论或建议，并不代表香港特别行政区

政府、工业贸易署或中小企业发展支援基金及发展品牌、升级转型及拓展内销市场的专项基金（机构支援计划）

评审委员会的观点。

Any opinions, findings, conclusions or recommendations expressed in this material/event (or by members of

the Project team) do not reflect the views of the Government of the Hong Kong Special Administrative

Region, Trade and Industry Department or the Vetting Committee of the SME Development Fund and the

Dedicated Fund on Branding, Upgrading and Domestic Sales (Organisation Support Programme).



2018.12.6 星期四 Thursday AM

技术议题 Technical Track


10:15 – 11:00

领先的危废在线资源利用新方案柳祖善, 广州科城材料科技有限公司市场经理 Cosmo Materials Technology Co., Ltd.

11:00 – 11:45

如何最有效及具竞争力综合应用: ERP, MES, APM, TPM, WMS 和手机装置去管理工厂营运 How to Manage Plant Operations by Applying ERP, MES, APM, TPM, WMS and Mobile Devices Most Effectively and Competitively 严兆葭, Rocket Data Technology Ltd. 创办人合办: 环球电路板设备有限公司/ World Wide P.C.B. Equipment Co., Ltd.

11:45 – 12:30

罗杰斯 RO4835T™和 RO4450T™薄型材料介绍 Rogers RO4835T™ and RO4450T™ Thin Material Introduction 吴云龙, 罗杰斯科技（苏州）有限公司, 罗杰斯亚洲区技术服务经理 Clark Wu, Rogers Technical Service Manager, Asia, Rogers Technologies (Suzhou) Co., Ltd.

12:05 – 14:00

午休时间 Lunch Break



2018.12.6 星期四 Thursday PM

技术议题 Technical Track


13:30 – 14:15

创新之银触媒化学沉铜工艺流程 New Innovation SILVRKAT™ 3000 Process 陈文圣, 罗门哈斯电子材料亚洲有限公司产品市场行销经理 Vincent Chen, Product Marketing Leader, Rohm & Hass Electronic Materials Asia Ltd.

新颖 Riston® LDI 负型光阻应用于细线路半加成法 Novel Fine-line Riston® LDI Photo-resist for Modified Semi-additive Process 蔡宗翰, 杜邦电子材料研发科学家 Tsung-Han Tsai, R&D Chemist, DuPont Electronic Materials

14:15 – 15:00

感光覆盖膜在 FPC 及软硬结合板中的市场及技术发展 Application and Prospect of Photocured Polyimide in High-Precision FPC 童荣柏, 杭州福斯特应用材料股份有限公司主管工程师 Rongbai Tong , Staff Engineer, Hangzhou First Applied Material Co., Ltd.

15:00 – 15:45

新世代金属化制程 Next Generation Metallization Process For PCB & 5G Substrate 叶锭强, 施洛特(无锡)表面处理技术有限公司技术总监 Albert Yeh , Technical Director , Schlötter (Wuxi) Surface Technology Co., Ltd.

*除了特别备注外, 所有演讲以中文進行。

*All presentations will be given in Chinese unless special remark.



演讲介绍 Presentation Information

专题演讲 Keynote 2 2018.12.5

11:00 – 11:15

Bob Neves 先生 – IPC 国际电子工业联接协会

Mr. Bob Neves, Secretary & Treasurer, IPC Board of Directors & member of IPC Executive committee, IPC - Association Connecting Electronics

Industries®

Bob Neves 作为 IPC 董事会成员，在过去 33 年担任两个独立测试机构、麦克罗泰克实验室和麦克罗泰克实验室（中国）的主席兼首席技术官。

他曾担任 IPC 的 TAEC 主席、刚性董事会总务理事会主席、HDI 总务理事会主席、刚性董事会测试方法技术组主席、IPC TGAsia 技术联络、实

验室资格理事会主席，在他的职业生涯中也参与了美国和中国在内 50 多个 IPC 理事会。他还是 IEC TC52/91 测试方法理事会主席以及与塑料、

多氯联苯和 CCL 有关的 UL STP 标准理事会的成员。他还是 IPC 最高荣誉-名人堂的成员，同时也是 Coombs“印刷电路手册”中的一部分“可

接受性和制造电路板的质量”的作者，并撰写了许多关于测试和电子工业的文章和技术论文。

Bob Neves has spent the last 33 years as the chairman and CTO of Microtek Laboratories and Microtek Laboratories (China), both independent test

facilities. He has served as IPC’s TAEC chairman, Rigid Board General Committee chairman, HDI General Committee chairman, Rigid Board Test

Method Task Group chairman, IPC TGAsia Technical Liaison, Laboratory Qualifications Committee chairman and has been involved in more than 50

IPC committees in the US and Asia during his career. He also served as the IEC TC52/91 Test Methods Committee Chairman and member of the UL

STP Standards committees associated with Plastics, PCBs and CCL. He was inducted into the IPC Hall of Fame, the IPC’s highest lifetime honor and

serves on the IPC Board of Directors. Bob is also the author of the “Acceptability & Quality of Fabricated Boards” section of Coombs “The Printed

Circuit Handbook” and has authored many articles and technical papers about testing and the electronics industry.

专题演讲 Keynote 1 2018.12.5

10:45 – 11:00

钟泰强先生, 香港线路板协会会长/ 迅达科技企业(香港)有限公司, 亚太区业务发展执行副总裁

Mr. Canice Chung, Chairman, HKPCA / Executive Vice President, Asia Pacific Business Development, TTM Technologies Enterprises (HK) Ltd.

钟先生自 2012 年起先后担任迅达科技的亚太地区业务部执行副总裁和总裁；及在 2010 至 2012 年期間，担任亚太地区运营部门的首席执

行官。钟先生于 2005 年加入美维集团，并分别于 2006 年及 2007 年出任美维控股有限公司的执行董事和行政总裁。在此之前，钟先生出任

依利安达国际集团有限公司的执行董事。过往，钟先生曾在 Fairchild Semiconductors (HK) Limited、China Cement Company (Hong Kong) Limited、

the Astec Group 及震雄集团担任不同的管理职位。他自 2001 年至 2011 年担任香港线路板协会副会长，并于 2012 年起开始出任香港线路板协

会的会长。

Mr. Chung has served as TTM Executive Vice President and President, Asia Pacific Business Unit since 2012 and as Chief Executive Officer of TTM Asia

Pacific operating segment during 2010 - 2012. Mr. Chung joined former Meadville Group (TTM AP) in 2005, was appointed executive director in 2006

and CEO of Meadville Holdings Limited in 2007. Prior to that, Mr. Chung was Executive Director and CEO of Elec & Eltek International Holdings Limited

and Elec & Eltek International Company Limited till 2005. Formerly, Mr. Chung held various management positions at Fairchild Semiconductors (HK)

Limited, China Cement Company (Hong Kong) Limited, the Astec Group and the Chen Hsong Group. Mr. Chung was Vice Chairman of Hong Kong

Printed Circuit Association from 2001 to 2011 and Chairman of the association since 2012.




线路板市场当前的状况和未来的发展趋势 (特别强调车用线路板) The Current and Future Status of PCB (with Special Emphasis on Automotive PCB)

2018.12.5

11:15 – 11:40

Hayao Nakahara 博士, N.T. Information Ltd. 总裁

Dr. Hayao Nakahara, President, N.T. Information Ltd.

Dr. Hayao Nakahara was born in Japan, but raised in Shijiazhuang, capital of Hubei Province in China. He received basic education in Japan. He went to

the United States in 1963 to study at graduate schools at University of Washington in Seattle and Columbia University in NYC, where he received

doctorate degree in Electrical Engineering. He worked for Photocircuits Corporation and its affiliates from 1965 to 1990 in various functions, last as

international technology licensing manager. After leaving Photocircuits, he formed a PCB consultancy company, N.T. Information Ltd, and since then,

he has been traveling around the world visiting well over 500 PCB manufacturing companies in various parts of the world

线路板行业发展的驱动力和前景

The Drivers and Outlook of the PCB Industry

2018.12.5

11:40 – 12:05

姜旭高博士, Managing Partner, Prismark

Dr. Shiuk-Kao Chiang, Managing Partner, Prismark

姜旭高，拥有台湾国立清华大学材料科学与工程学士学位，美国 NotreDame 大学冶金工程硕士学位，美国俄亥俄州（Ohio）州立大学陶瓷工

程博士学位，以及美国俄亥俄州克利夫兰州立大学高级工商管理硕士学位。

在电子产业里对材料特性，新产品和流程工艺发展，研发管理，以及技术市场有着丰富的经验。他在电子材料，封装，和流程工艺领域拥有

专利，奖项，和专业论文。他在 1998 年 2 月成为 Prismark 合伙人。主要负责 Prismark 在亚洲市场的开发，以及从事对日本，台湾，中国大

陆，韩国，新加坡，和其他亚洲国家电子产业的研究。在过去的几十年里，Prismark 在电子，半导体，封装，组装，PCB，和材料领域已和很

多公司建立合作和服务关系。另外，Prismark 也为亚洲主要金融机构提供投资方面的咨询和服务。

Shiuh-Kao Chiang has a B.Sc., M.S., Executive M.B.A., and a Ph.D. in Ceramic Engineering from Ohio State University.

Shiuh-Kao’s past experience includes material characterization, new product and process development, R&D management and technical

marketing. Shiuh-Kao holds several patents, awards, and publications in electronic material, packaging, and processing areas. He joined Prismark in

February 1998.

Dr. Shiuh-Kao Chiang is responsible for the development of Prismark’s business in Asia, as well as the management of research projects and services in

Japan, Taiwan, China, Korea, Singapore, and other Asian countries. Over the past 20 years, Prismark has developed business and service relationships

with most of the leading electronics, semiconductor, packaging, assembly, PCB and material companies in Asia. In addition, Prismark has also

extended its services to leading financial institutions to assist their investments in Asia.

PCB Reliability Test for Automotive and IoT Products Application

对汽车和物联网产品上应用的 PCB 可靠性测试

2018.12.5

14:00 – 14:30

黄婉仪女士, 香港生产力促进局汽车及电子部, 高级工程经理

Ms. Angel Wong, Senior Engineering Manager, Automotive & Electronics Division, Hong Kong Productivity Council

黄婉仪女士拥有超过 20 年的可靠性测试经验，现任生产力促进局汽车及电子部高级工程经理同时是香港生产力促进局电磁兼容科技中心, 无

线测试中心,及电子可靠性测试中心主管。黄女士是美国认可可靠性专业人员(CRP) ，英国特许物理学家(CPhys)，英国特许科学家(CSci) 及

IPC-A-600CIT 培训师。

Ms. Angel Wong has more than 20 years of experience in reliability testing of electronics components and products. She is now the Senior Engineering

Manager of Automotive & Electronics Division of HKPC and also Officer-in-Charge of the Electromagnetic Compatibility Centre, Wireless Testing

Centre, and Electronics Reliability Testing Centre of HKPC. Ms. Wong is a Certified Reliability Professional (CRP), Chartered Physicist of the Institute of

Physics(CPhys), Chartered Scientist (CSci) of the Science Council, as well as a certified IPC-A-600 CIT Instructor.




PCBA 在汽车电子的应用

Build for Automotive

2018.12.5

14:30 – 15:00

朱惠璋先生, 德丰电业有限公司董事长

Mr. Wilson Chu, Chairman of Defond Electrical industries Ltd.

朱惠璋先生，1998 年香港青年工业家奖得奖者

公司 : 德丰电业有限公司，职衔 : 董事长

出身于工程学的朱惠璋先生，于 1978 年与其兄合营德丰电业有限公司，从事电子业，专注研发及售卖开关掣，是本港少数以专事生产开关起

家的制造厂。德丰逾三十年来的发展，由最初以生产小家电开关掣为主，到现在兼营电工具用开关掣及电子组装，产品可谓多元化，并已成

为一所生产多种类电器零部件生产商。

德丰总部设于香港、厂房位于东莞。主要产品除开关掣外，亦包括漏电保护器、机电组件、流体控制元件和电动工具控制器等多个不同产品

领域，是香港最大的开关制造商，亦是全球数一数二的电子零部件领先企业。公司其后研究咖啡机用电水泵, 收购意大利专事生产咖啡机电

磁阀的 ODE, S.r.l. 品牌, 投产后更得到国际名牌雀巢公司等的采用。而借着收购德国汽车工业开关商 BJ Automotive GmbH，发展高档汽车开关

市场，专攻高质客户群汽车开关，将公司发展成为业务遍及全球 60 个国家皆有分销，是一间足迹远至南美及中东的企业。

朱惠璋先生一直重视产品质素，德丰可算得上是香港首家取得认证、品质有保证的生产商。多年来公司订定一系列品质管理，德丰产品由自

设的厂房生产，生产过程引入全自动及半自动化设备，模具及生产设备由自家的厂房制作，生产技术掌握纯熟，务求维持高产品质素；德丰

积极求进步，务求迎合顾客及市场需要。除继续保持高品质出品外，朱惠璋先生亦十分重视研发新产品的工作，建立属于德丰的品牌产品，

务求带领潮流，创造公司价值。

消费电子用线路板技术发展趋势 A View on Consumer PCB Technology Trends

2018.12.5

15:00 – 15:30

Erkko Helminen 先生–迅达科技企业(香港)有限公司, 企业先进发展高级经理

Mr. Erkko Helminen, Senior Manager Advanced Development – Corporate, TTM Technologies, Inc.

Mr. Erkko Helminen(M.Sc.) 曾获拉彭兰塔技术大学工业电子学专业硕士学位。Mr. Erkko Helminen 是 TTM 技术公司先进技术开发(AD)高级经理。

他主要负责先进技术 AD 项目管理、过程开发、SI 工程和材料工程，他现在也是 TTM 广州公司技术中心部门代理经理。Mr. Erkko Helminen 曾

先后于 Aspocomp、MeAdville 和 TTM 担任过几个工程和开发管理职位。他现关注的是 PCB 领域未来的制造工艺、材料、高速 PCB 技术和先进

的互连技术。

Mr. Erkko Helminen (M.Sc.) is Advanced Development (AD) Senior Manager at TTM Technologies, Inc. His key responsibilities are AD project

management, process development, SI engineering and material engineering. He’s acting department manager in TTM Corporate Tech Center in

Guangzhou. He received his diploma M.Sc. from Lappeenranta Univ. of Technology majoring in industrial electronics. He has held several engineering

and development management positions in Aspocomp, Meadville, and TTM. His interests in PCB area are future fabrication processes, materials, high

speed PCB technologies, and advanced interconnection technologies.

2018 中国环保政策热点解读 A view of 2018 China's Environmental Protection Policy

2018.12.5

15:30 – 16:00

王乐得先生, 香港线路板协会, 副会长兼秘书长

Mr. Luther Wong, Vice Chairman & Secretary General, HKPCA

王乐得先生 1984 年加入美国励乐(亚洲)有限公司(现合并至陶氏化工)，92 年担任亚洲区行政总裁，管理特殊化学添加剂业务。王先生是国内

投身环保事业的先驱，在 2001 年离任陶氏化工，在 2002 年与欧洲合作伙伴创办思捷环保科技有限公司，为亚洲区 - 特别在中国的电路板、

半导体、电子业、贵金属、汽车及五金电镀等行业设计、生产、安装及营运纯水、废气、废水、耗材/水回用及减排节能系统，至今已完成超

过 600 个各类工业环保工程。近年积极拓展耗材线上回用及各种减排节能系统。同时，王先生在多个行业协会及政府部门担任公职，2005 年

出任中国人民政治协商会辽宁省委员会常务委员及港区召集人，2015 年获香港特别行政区政府委任为太平绅士。




如何最有效及具竞争力综合应用: ERP, MES, APM, TPM, WMS 和手机装置

去管理工厂营运

How to Manage Plant Operations by Applying ERP, MES, APM, TPM, WMS and Mobile

Devices Most Effectively and Competitively

2018.12.6

11:00 – 11:45

严兆葭, Rocket Data Technology Ltd.创办人

2000 年,美国毕业后,于美国 IBM 及 EFI 从事工厂生产系统设计。

2007 年, 开始从事家族工厂管理, 分别在香港屯门及马来西亚地区, 主要从事销售和生产, 多年前引入全美式数据管理系统。

2016 年, 创办洛奇公司, 与 2 位美国史丹福毕业总工程师开发及设计整个新一代的云端 MES 系统, 并协助和教育不同行业的二厂发展

和计划工业 4.0 和中国制造 2025 的实施方法。

罗杰斯 RO4835T™和 RO4450T™薄型材料介绍

Rogers RO4835T™ and RO4450T™ Thin Material Introduction

2018.12.6

11:45 – 12:30

自动测试设备和新兴的 5G 毫米波设计要求有多种厚度薄的材料可供选择。设计工程师迫切希望找到能提供多种

厚度选择的热固性材料。

RO4835T™覆铜板，RO4450T™半固化片和 CU4000™ & CU4000 LoPro®铜箔为这个市场需求提供了整体解决方案，

满足客户所期望的铜箔压合工艺要求。

The Automated Test Equipment (ATE) and emerging 5G millimeter wave designs require materials with a variety of thin

thickness options. Designers are looking for thermoset dielectrics that offer multiple thickness options.

RO4835T™ Laminates, RO4450T™ Bonding Materials, and CU4000™ & CU4000 LoPro® Foil Options brings to market a

multiple thickness thin material solutions package that offers a Commercially available sheeted foil option for

customers preferring foil lamination designs.

吴云龙, 罗杰斯科技（苏州）有限公司, 罗杰斯亚洲区技术服务经理

2002 年毕业于华南理工大学工程机械专业。

2004-2008 年就职于广州惠亚集团，负责 PCB 制造工艺。

2008 年加入罗杰斯科技（苏州）有限公司，从事加工技术支持，并负责苏州缺陷分析实验室。

Clark Wu, Rogers Technical Service Manager, Asia, Rogers Technologies(Suzhou) Co., Ltd

Graduated from South China University of Technology in 2002, majored in engineering machinery.

Took charge of PCB manufacturing process in Guangzhou Huiya Group from 2004 to 2008.

Engaged in fabrication technology support in Rogers Corporation from 2008, and responsible for defect analysis lab in Suzhou.




感光覆盖膜在 FPC 及软硬结合板中的市场及技术发展

Application and Prospect of Photocured Polyimide in High-Precision FPC 2018.12.6

14:15 – 15:00

感光覆盖膜工艺技术是 FPC 发展的必然趋势，并将带来明显的好处。通过贴膜、图像转移工艺得到的保护膜能够

很好解决焊盘的精确对位问题，可制造出更精细的焊盘。同时采用感光覆盖膜大大缩短了传统覆盖膜的工艺流程，

节省人力、提升效率。

The process technology of the photosensitive coverlay is an inevitable development trend of FPC and will bring obvious

benefits. The protective film obtained by pressing and performing the image transfer process can well solve the

problem of accurate alignment of the pads and can produce finer pads. At the same time, the use of the photosensitive

cover film greatly shortens the process of the conventional cover film, saves manpower and improves efficiency.

童荣柏, 杭州福斯特应用材料股份有限公司主管工程师

童荣柏博士，毕业于浙江大学化学工程与生物工程学院，高分子化学与物理专业，2015 年 7 月加入杭州福斯特，主要从事聚酰亚胺树脂体系

和丙烯酸树脂体系感光覆盖膜开发工作，对光敏性聚酰亚胺和光固化技术及应用有深入的研究。

Rongbai Tong, Staff Engineer, Hangzhou First Applied Material Co., Ltd.

Dr. Tong Rongbai graduated from the College of Chemical Engineering and Bioengineering of Zhejiang University with a major in polymer chemistry

and physics. He joined the Hangzhou First in July 2015 and is engaged in the development of polyimide resin systems and acrylic resin systems

photosensitive coverlay. In-depth research on photosensitive polyimide and photocuring technology and application.

新世代金属化制程 Next Generation Metallization Process For PCB & 5G Substrate

2018.12.6

15:00 – 15:45

高频讯号的发展将进入 5G 科技的领域中，不论 PCB 材料的选择、前处理的考量、金属化稳定性与 CAF 议题皆迎

来挑战。然而 SLOTOGO 制程拥有独特的金属化特性，能与电镀制程产生共利，于众多候选新材质上也能达到良

好的金属化稳定性，其制程不但稳定且环境友善，在药浴管理方面亦非常简便。另一方面，SLOTOGO 还能够改善

现阶段 HDI-mSAP 与铜柱制程之瓶颈。因此，SLOTOGO 将是能满足 5G PCB 的新世代金属化制程。

The development of high-frequency signals will apply on the field of 5G technology, which has to face the challenges

such as the selection and pretreatment of PCB materials, metallization stability and CAF issue…. The SLOTOGO process

which gets the good stability on new materials not only performs unique metallization property, but reach excellent

plating performance together with specific plating process. On process control aspect, it is very stable, simple

maintenance and environmentally friendly. Moreover, SLOTOGO also effectively improves the defects of HDI-mSAP and

Cu pillar process. Therefore, SLOTOGO will be a new generation metallization process that certainly fulfills all the

demands of 5G technology.

叶锭强, 施洛特(无锡)表面处理技术有限公司技术总监

在金属表面处理和电镀技术服务方面拥有超过 35 年的经验。

在 PCB-HDI 产品开发和技术服务方面拥有超过 10 年的经验。

Albert Yeh , Technical Director, Schlötter (Wuxi) Surface Technology Co., Ltd.

More than 35 years experience on metal finishing & electroplating technical service.

More than 10 years experience on PCB-HDI product development and technical service.

2018 国际技术会议 - hkpca.org · 2018 international technical conference ... rongbai tong ,...

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