ts-dem development of electronic modules group

of 41 /41
CERN TS -DEM CERN Erik van der Bij TS-DEM Development of Electronic Modules Group Erik van der Bij CERN

Author: oakes

Post on 13-Jan-2016

26 views

Category:

Documents


3 download

Embed Size (px)

DESCRIPTION

TS-DEM Development of Electronic Modules Group. Erik van der Bij CERN. Agenda. Services and organisation of TS-DEM Organisation of files in EDMS (AB/PO) Reliability engineering. MANDATE Turn schematics into boards (standard + special). PCB design Manufacture of special circuits and PCBs - PowerPoint PPT Presentation

TRANSCRIPT

Page 1: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

TS-DEM

Development of Electronic ModulesGroup

TS-DEM

Development of Electronic ModulesGroup

Erik van der Bij

CERN

Page 2: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

AgendaAgenda

Services and organisation of TS-DEM

• Organisation of files in EDMS (AB/PO)

• Reliability engineering

Page 3: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

MANDATETurn schematics

into boards (standard + special)

MANDATETurn schematics

into boards (standard + special)

• PCB design

• Manufacture of special circuits and PCBs

• Assembly

Page 4: TS-DEM Development of Electronic Modules Group

Examples of ‘standard’ work

Examples of ‘standard’ work

Page 5: TS-DEM Development of Electronic Modules Group

Circuit Manufacturing

DEM-PMT

Industry

Circuit or moduleRequest

TS-DEM TS-DEM

Subcontractingordering, collecting components, tracking

Design Office

DEM-BE

Assembly Workshop

DEM-WS

Planning Officetechnological and commercial choices

invoicing DEM-BE

DEM-BE

Page 6: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

BE – Design officeBetty Magnin

BE – Design officeBetty Magnin

• Layout of PCB, flexible circuit, hybrid or fine-pitch detectors

• Design of associated small mechanics (front-panels, crates)

• Creation of schematic and padstack symbols – Cadence and PCAD/Altium libraries

• Storage of manufacturing files – PCB production, assembly, bill of material all in EDMS (EDA-xxxxx)

• Organisation of production and assembly– prototype quantities: in-house or local industry

– larger quantities: European industry

• Component purchasing service (new!)• Technical advice on manufacturing

Easy wayto savetime!

Easy wayto savetime!

Page 7: TS-DEM Development of Electronic Modules Group

Example of mechanicsExample of mechanics

Page 8: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

PMT – FabricationRui de Oliveira

PMT – FabricationRui de Oliveira

• Special circuits– flex-rigid boards – multi-layer boards with integrated metal or pyrolytic carbon– high-definition circuits (traces and isolation 5 to 10 μm)

• Thick-film hybrids – seriegraphy of conducting paste on ceramic substrates

(aluminium, aluminium nitride, berillyumoxide)

• Chemical treatment – thin metal sheets (copper, inox, nickel, aluminium, titanium)

• Standard printed circuit boards (halogen free!)– single side to multi-layer boards (upto 14 layers, class 6) – flexible circuits (kapton)

• Technical advice on material selection and processes

Page 9: TS-DEM Development of Electronic Modules Group

TransferImage

TransferImage

Page 10: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der BijPercagePercage

Page 11: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

Electrical testElectrical test

Page 12: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

WS – Assembly workshopBetty Magnin

WS – Assembly workshopBetty Magnin

• Mounting of components – through-hole

– BGA downto 0.8 mm pitch

– resistors and capacitors downto 0201 size

• Replacing of components, including BGA

• Production of cables (coax, flatcables, twisted pair)

• Wiring of crates

• 30-minute express service for small interventions

• Cleaning of boards

• Technical advice – component selection and manufacturing

Page 13: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

Condensation ovenCondensation oven

Page 14: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

Cleaning of circuitsCleaning of circuits

Before cleaning

After cleaning

Page 15: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

Turn-around time

Turn-around time Prototype electronics production

multi-layer PCB, standard priority

• This time can be reduced if necessary!

• PCB fabrication can handle 2 urgencies per week

– e.g. double sided PCB in 1 day, single sided 0.5 day

• Replacement of component: 30 minute service

Queue

2-3 weeks

Layout

1-2 weeks

Layout (and queue)

4 weeks

PCB fabrication

3 weeks

Assembly

2 weeks

Margin

1 week

Page 16: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

PCB Delivery timesPCB Delivery times

TypeUrgent[days]

Standard[days]

Single sided   1

Double sided with metallised vias 1 5

4 and 6 layer with metallised vias 3 or 6 10

> 8 layers with metallised vias 3 or 6 15

• Fast track PCB layout (since July 2007):

• Small jobs (estimated ≤ 2 days) will be started immediately or on next day

Page 17: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

• Layout and PCBs needed ASAP

• Received request 7 March 2007

• Same day layout finished!

• 4 PCBs ready on Friday 9 March,rest on Monday after

• Assembled 1 PCB on Friday 9 in evening,second finished on the 12th.

Example:Urgent full project for PH

Example:Urgent full project for PH

Page 18: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

Example:Urgent project for AB/CO

Example:Urgent project for AB/CO

• Layout ready: three different PCBs needed ASAP

• Needed really fast:– no solder maks or silkscreen finish needed

• Design files given Friday 30 March 7:00

• PCBs ready same day at 15:00!

• Could have assembled connectors if needed

• Two weeks later tests finished, production of series requested

Page 19: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

ConclusionsConclusions

• DEM provides you a turn-key solution

– from your schematics to assembled boards

– all services close to the engineers

– production in small to medium quantities

– advice on manufacturing (material, components, processes)

• DEM has contracts with industry

– local industry for prototyping

– in other CERN member states for medium scale production

• The service can save you a lot of time and cost

Page 20: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

DEM on the web

DEM on the web

http://cern.ch/demhttp://cern.ch/dem

DEMon

the web!

DEMon

the web!

Page 21: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

PCAD to Altium

PCAD to Altium• PCAD stops support after 2006

– With ELEC committee IT decided to move to Altium

– Altium can read PCAD schematics and PCB layout

– Altium is a bit more difficult to use (notably PCB layout)

– Presentation on Tuesday 10/7 (amphi bld. 30, 8:30-12:15)

– Two day courses will be given from September on

– Pilot course in July

Page 22: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

Storage of design filesin EDMS

Storage of design filesin EDMS

Files stored in EDMS since 2002

http://edms.cern.ch/nav/eda-xxxxx

BE: Schematics, PCB design & production, BOM & assembly files, mechanics

User: specification, images, supplier info

• Handling of 'executions' since 2006project with AB/PO

Page 23: TS-DEM Development of Electronic Modules Group

Selon convention signée par AB-PO et TS-DEM (Document EDMS 801714 v1)

1 carte: HCRBSxxxxx = EDA-yyyyy-Vx-xUn dossier de fabrication unique

GEREGHCREHAR002

Code de fabrication TS-DEM: EDA-xxxxx-Vx-xCode d’exploitation AB-PO : HCRBSxxxxx

Enregistrement des cartes fabriquées par TS/DEM

Christophe Mugnier :Présentation du 16 Juin 2006

Page 24: TS-DEM Development of Electronic Modules Group

Dossiers de fabrication TS/DEM

Christophe Mugnier :Présentation du 16 Juin 2006

Page 25: TS-DEM Development of Electronic Modules Group

Dossiers de fabrication TS/DEM - Identification d'une carte

La sérigraphie de la face avant :Elle comporte le code EDA et la désignation de la carte.

Etiquette apposée par l’assembleur sur le connecteur dans le cas d’une exécution.

La sérigraphie du print: Elle comporte le code EDA+la version et la désignation de la carte.

Page 26: TS-DEM Development of Electronic Modules Group

Dossiers de fabrication TS/DEM - Identification d'un chassis

La sérigraphie de la face avant :Elle comporte le code EDA et la désignation du chassis.

Etiquette apposée par l’assembleur pour spécifier la version.

Page 27: TS-DEM Development of Electronic Modules Group

Dossiers de fabrication TS/DEM - Example en EDMS

Example:http://edms.cern.ch/nav/eda-01586

Page 28: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

Reliability engineeringReliability engineering

In development phase: qualitative strategy– Find weak points fast - whatever it takes

• Accelerated testing: quantative strategy– get idea of final reliability

– concepts (without acceleration) also valid to get data for our installed base

Ideas from Hobbs Engineering course "Demonstrating Reliability Requirements with Accelerated Testing" and book "Accelerated Reliability Engineering - HALT and HASS"

http://hobbsengr.com, see also http://weibull.com

Page 29: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

Stress-Strength "Non-interference"

Stress-Strength "Non-interference"

Page 30: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

Qualitative strategy

Qualitative strategy

Page 31: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

Effect of qualitative testing

Effect of qualitative testing

Page 32: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

HALT

HALT

Page 33: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

PDF to CDF

PDF to CDF

Pro

bab

ilit

y

Time Time

Un

reli

abil

ity

Un

reli

abil

ity

Time

Page 34: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

Weibull function handles all shapes

Weibull function handles all shapes

Page 35: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

Paperclip example

Paperclip example

Page 36: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

Calibrated Accelerated Lifetime Test

Calibrated Accelerated Lifetime Test

Page 37: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

Example of Voltage CALT

Example of Voltage CALT

Car

ele

ctro

nics

12-

15 V

olt

Page 38: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

Example of Tcycle CALT

Example of Tcycle CALT

Page 39: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

Wiper graphWiper graph

Page 40: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

A serious test flow

A serious test flow

Page 41: TS-DEM Development of Electronic Modules Group

CERN TS -DEM

CERN

Erik van der Bij

ConclusionsConclusions

• Development

– have fun with your cards and 'burn' a few. You learn a lot!

– temperature, voltage, vibration, on/off cycles...

• Know (measure) the environment of your cards

– e.g. on-time, on/off cyles and temperature variations

– is needed to calibrate acceleration factors

• Measure precisely the on-time, on/off cycles etc of each card to know precisely when failed

– allows Weibull plotting and gives invaluable reliability data