from fit for standard to fit for application · 2018-10-19 · from fit for standard to fit for...

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From Fit for Standard to Fit for Application Eckhard Wolfgang, ECPE e.V. Nuremberg, Germany [email protected] Acknowledgements: Guenter Engel (CeraCap Engel KG) Uwe Scheuermann (Semikron) Werner Kanert (former Infineon) Nando Kaminski (Univ Bremen) Martin Rittner (Bosch) Markus Thoben (Infineon) Johann Kolar (ETHZ) 1

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From Fit for Standard to Fit for Application

Eckhard Wolfgang, ECPE e.V.

Nuremberg, Germany

[email protected]

Acknowledgements: Guenter Engel (CeraCap Engel KG)

Uwe Scheuermann (Semikron)

Werner Kanert (former Infineon)

Nando Kaminski (Univ Bremen)

Martin Rittner (Bosch)

Markus Thoben (Infineon)

Johann Kolar (ETHZ)

1

2

80 Industrial Members

The Basic Question

3

Is our product

"sufficiently reliable"

in the application?

Have I passed my

qualification tests

according to the

standard?

Fit for use

Fit for standard

RV – A Knowledge-Based Approach

4

material

process

design

temperature

humidity

V, I others

mission profile

failure mechanisms

system components

RV is a knowledge-based approach:

Knowledge of the conditions of use (mission profile)

Knowledge of the failure mechanisms and failure modes

Knowledge of acceleration models for the failure mechanisms

Outline

Introduction

AECQ Standards

Robustness Validation

Mission Profile

Estimation of Lifetime

ECPE Guidelines AQG 324 for Power Module Qualification

Qualification of DC-link Capacitors for Automotive Use (ZVEI)

Power Electronics Integration

Paradigm Shift

Summary

5

AECQ Standards

6

AEC - Q101 - Rev – D1

September 6, 2013

FAILURE MECHANISM BASED

STRESS TEST QUALIFICATION

FOR

DISCRETE SEMICONDUCTORS

IN AUTOMOTIVE APPLICATIONS

Zero Failure out of 77 samples means:

The probability is 90% that the accepted lot contains

up to 0.14% = 1.400 ppm faulty parts

This criterion does not fit to the needed automotive

low ppm-level of todays applications

Appendix 7: Guidance on Relationship of Robustness Validation to AEC-

Q101

A qualification method has recently been developed with the intent of

addressing application specific operations. Called Robustness Validation,

this method considers the specific environmental and operational

application conditions and the customer lifetime requirements to calculate

the minimum required set of qualification test conditions, durations

and sample sizes. Ref [ 1 ]

Robustness Validation Handbooks

7

3D-PEIM June 27. 2018 Ref [ 2 ]

http://standards.sae.org/j1211_201211/

SAE Standard J1211

8 3D-PEIM June 27. 2018

Robustness Validation

The new 'test to fail' qualification approach

(instead of a 'test-to-pass'), is a paradigm shift from

'Fit for Standard' to 'Fit for Application'.

Robustness Validation generates knowledge on

the relevant component failure mechanisms that

may occur at the boundaries of the specification

limits.

9 3D-PEIM June 27. 2018

Mission Profile

A Mission Profile is a simplified representation of relevant conditions to

which the Device/ Component production population will be exposed in

all of their intended application throughout the full life cycle of the

component.

10 Ref [4 ]

Mission Profile: A Gordian Knot

11

1st and 2nd Tier OEM

Mission Profile

- Drive profiles

- Relevant

stresses

-Type of EM

- Power Module

- Cooler

- Zth

Lifetime Model

of Power Module

1) What is the lifetime of your

Power module? 2) What is your Mission Profile?

3) I cannot tell you because it

is confidential! 4) Then I cannot tell you!

N

∆T

Mission Profile: How to cut the Gordian Knot

12

1st and 2nd Tier OEM

Mission Profile

- Drive profiles

- Relevant

stresses

-Type of EM

- Power Module

- Cooler

- Zth

Lifetime Model

of Component

N

∆T

OEMs calculate the number of

Power Cycles using the

„confidential“ Mission Profile

Bond wire lift-off

Robustness Margin

Estimation of Lifetime

13

Ref [ 4 ]

14

Consolidated Results after Rainflow Counting

0

5

10

15

20

25

30

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39

Supplier A 2K

Supplier B 2k

Academic A 2K

Supplier C 2k corr.

Supplier D

Supplier E

Delta T

Time

T

Num

ber

ECPE Guideline AQG 324

15

Scope This document defines requirements, test conditions and tests for

validating properties, including the lifetime of power electronics

modules and equivalent special designs based on discrete

devices, for use in power electronics converter units (PCUs) of

motor vehicles up to 3.5t gross vehicle weight.

.

Qualification of Power Modules for Use in Power Elec-

tronics Converter Units (PCUs) in Motor Vehicle

The described tests concern the module design as well as the

qualification of devices on module level (i.e.the assembly),

but not the qualification of semiconductor chips or manufacturing

processes

Ref [ 5, 6 ]

Power cycling reliability of IGBT4

Power Cycling target IGBT5

1.E+04

1.E+05

1.E+06

1.E+07

40 60 80 100 120

delta Tj (K)

no

of

cycle

s

Ref IGBT 4 Tvj 150°C

Page 16

Ref [ 7 ]

PCsec Test Conditions

17

Forward voltage IGBT: UCE,sat MOSFET: UDS Diode: UF

+ 5 % a

Increase in virtual junction temperature swing

∆Tvj

+ 20%

Failure Criteria

18

Power Cycle Test Results with Different

Control Strategies

Source: U.Scheuermann, ESREF 2010

1. Constant timing

2. Constant ΔTbaseplate

3. Constant power dissipation

4. Constant ΔTjunction

Failure criteria

3D-PEIM June 27. 2018 Ref [ 8 ]

Lifetime Models for a certain IGBT module technology showing the

impact of power cycle ton times at a given aspect ratio of the bond loop

Life Time Model/ Reliability Curve

19

Semikron

3D-PEIM June 27. 2018 Ref [ 9 ]

Power Module Testmatrix

20

Part of Power Module Test Matrix

Thermal Shock

Contactability

Vibration

UGE,th Gate-Emitter-Threshold Voltage

UGS,th Gate-Source-Threshold Voltage

21

22

Ref [ 10 ]

23

Vibration

Electrical Characterisation E-01 … E-05

Mechanical Characterisation M-01, M-02

High

humidity, T

High

temp.

Charge,

discharge

Mechanical Characterisation M-01, M-02

T-shock

Electrical Characterisation E-01 … E-04

6 capacitors are tested for each of the 4 groups

Short

circuit

DC-link film C: Testplan

24 Ref [ 11 ]

Reliability Analysis CeraLink Capacitor

25

Ref [12 ]

Integrated DC-link Capacitor Systems for HP IGBT Modules

26

SBE - Infineon

From Top:

- Control board

- IGBT module

- Liquid cold plate

- Film capacitors

EPCOS - Infineon Ref [ 13 ]

Ref [ 14 ]

Litte Box Target: > 50 W/in3 Winner CE+T 145 W/in3

Ref [ 15 ]

27

28

Paradigm Shifts

Paradigm shifts Industry needs

Power

devices

SiC and GaN will become more

and more qualified for several

subsystems, like 48 V board net

and LED headlight

Learning curve for WBG-

devices: optimizing special

properties

Packaging &

Substrates

For SiC- and GaN- devices RF

compatible packages and

low inductive interconnects are

necessary. This calls for new CAD

tools as well.

Learn about:

RF interconnections

New materials

Smaller geometries

Testing capabilities (RF,

size)

Power

modules

Low inductive arrangement of

multichip modules

New module designs

with precautions

regarding attachment to

RF PCB and

heat sinks 3D-PEIM June 27. 2018

29

Cooling Two-phase cooling will become

more important as well as double-

side and immersion cooling

Integrated systems are

needed to avoid TIM

interfaces as much as

possible

Reliability From "Fail safe" to "Fail operation"

by using Fault tolerant designs

Intensive use of "by-

wire" systems

48 V board

net

The many more electronic

subsystems consume more power

Adequate connectors

and

test fixtures

Sensors High reliable and for automotive

qualified sensors for many (new)

functions

Placing and wiring of

EMI compatible

sensors

calibration of sensors

Testing More and better lifetime models for

accelerated testing

New RF capable test

equipment

3D-PEIM June 27. 2018

Summary 1

30

German car makers, 1st and 2nd Tiers developed a guide line for

“Qualification of Power Modules for Use in Power Electronics

Converter Units in Motor Vehicles”

The original idea was to be able to compare “apples with apples”

The Robustness Validation Process was the basis for the guideline

It is a knowledge based process

Conditions of use (Mission Profile)

Physics of failure

Acceleration models for failure mechanisms

It is difficult to get mission profiles

The solution is an active cooperation between OEMs and Tiers

Standardized tools for modeling and simulation are prerequisites

Summary 2

31

A similar approach was chosen for the guideline on

“Qualification of DC-link Capacitors for Automotive Use”

The sample size for tests is 6 only

End-of-life tests should be used whenever it is possible

Beside the use of WBG power devices – SiC and GaN – integration

is the most promising goal in future

An data sheet is proposed as well as a Delta-qualification matrix

Both guidelines can be downloaded by ECPE (PM) and ZVEI (DC-link)

There will be quite a few paradigm shifts in future which will have

great impact on reliability and manufacturing

References/ 1

32

[ 1 ] http://www.aecouncil.com/Documents/AEC_Q101_Rev_D1_Base_Document.pdf

[ 2 ] Handbook for Robustness Validation of Automotive Electrical/Electronic

Modules

http://standards.sae.org/j1211_201211/ and

https://www.zvei.org/en/subjects/mobility/robustness-validation-general/

[ 3 ] E.Wolfgang, Ten years of Robustness Validation Applied to Power Electronics

Components, IWIPP 2017

http://ewh.ieee.org/soc/cpmt/presentations/cpmt1704a.pdf

[ 4 ] M. Thoben, K. Mainka, R. Bayerer, I. Graf, M. Münzer, From vehicle drive

cycle to reliability testing of Power Modules for hybrid vehicle inverter

https://pdfs.semanticscholar.org/fc43/

763c8dcbbed39496a925aa18f29424ae8f57.pdf

[ 5 ] M. Rittner, M. Thoben,K.Kriegel, Automotive: Qualification Routines

for Power Electronics Components in Electrified Powertrains,

CIPS 2018 (will be available on IEEE Xplore)

[ 6 ] AQG 324: ww.ecpe.org/news-projects/network-news/current/details/

?tx_ttnews[tt_news]=502&cHash=ed72de196165af05572467c04f03de87

References/ 2

33

[ 7 ] Bayerer, R.: Advanced packaging yields higher per formance and reliability

in power electronics, Microelectronics Reliability 50 (2010) 1715-1719

[ 8 ] Scheuermann, U., Schuler, S.: Power cycling results for different control

strategies, Microelectronics Reliability 50 (2010) 1203-1209; IEEE Xplore

[ 9 ] U.Scheuermann, R.Schmidt, A New Lifetime Model for Advanced Power

Modules with SinteredChips and Optimized Al Wire Bonds, PCIM Europe 2013

[ 10 ]Reliability of Power Electronic Converter Systems, Ed. by H. S. Chung,

H. Wang, F. Blaabjerg and M. Pecht; IET Power and Energy Series 80,

ISBN 978-1-84919-902-5 (PDF)

[ 11 ] Qualification of DC-link Capacitors for Automotive Use:

tps://www.zvei.org/fileadmin/user_upload/Presse_und_Medien/Publikationen/

2017/Juli/Qualification_KFZ-DC-Link-Capacitors/

ZVEI-Qualification_KFZ-DC-Link-Capacitors_V2_2017.pdf

[ 12 ] https://en.tdk.eu/download/1530392/fdf3adf69e5de3da18240716dd985ca2/

ceralink-kondensatoren-pb.pdf

[ 13 ] https://en.tdk.eu/tdk-en/373562/tech-library/articles/applications---cases/

applications---cases/space-saving-dc-link-solution/171874